Microscope image of electromigration-induced hillock and void
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Electromigration (all content)
Electromigration - an overview
Electromigration - an overview
Coupling model of electromigration and experimental verification – Part II: Impact of thermomigration - ScienceDirect
Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration, Journal of Materials Research
Electromigration Reliability in Ag Lines Printed with Nanoparticle Inks: Implications for Printed Electronics
PDF) Hillock formation during electromigration in Cu and Al thin films: Three‐dimensional grain growth
In-Situ Observation and Quantitative Analysis of Electromigration Void Dynamics
Electromigration in Metallic Materials and Its Role in Whiskering - ScienceDirect
Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects (Chapter 3) - Electromigration in Metals
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